Issued Patents 2004
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6672947 | Method for global die thinning and polishing of flip-chip packaged integrated circuits | John Valliant | 2004-01-06 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6672947 | Method for global die thinning and polishing of flip-chip packaged integrated circuits | John Valliant | 2004-01-06 |