CL

Cheng-Wei Lee

TSMC: 1 patents #234 of 898Top 30%
📍 New Taipei, TW: #130 of 408 inventorsTop 35%
Overall (2004): #246,867 of 270,089Top 95%
1
Patents 2004

Issued Patents 2004

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
6730602 Method for forming aluminum bumps by sputtering and chemical mechanical polishing 2004-05-04