Issued Patents 2004
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6711812 | Method of making metal core substrate printed circuit wiring board enabling thermally enhanced ball grid array (BGA) packages | Jane Lu, Paul S. Wu, Ray T. Chen, Scott Zhihao Chen | 2004-03-30 |