JM

Joerg Mahrle

CG Conti Temic Microelectronic Gmbh: 1 patents #1 of 27Top 4%
📍 Göppingen, DE: #5 of 13 inventorsTop 40%
Overall (2004): #189,191 of 270,089Top 75%
1
Patents 2004

Issued Patents 2004

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
6740982 Microelectronic package with an attachment layer including spacer elements Klaus Sauter 2004-05-25