| #38 |
Reuven Duer |
Ldip |
1 |
| #38 |
Vince Catlin |
Panavision |
1 |
| #38 |
Warren Tan |
Citicorp Credit Services, Inc. (Usa) |
1 |
| #38 |
Edward K. Huang |
Teledyne Flir Commercial Systems |
1 |
| #38 |
Peter Mok |
Advanced Ion Beam Technology |
1 |
| #38 |
Manouchehr E. Motamedi |
Rockwell International |
1 |
| #38 |
Olaf Kinstler |
Amgen |
1 |
| #38 |
Richard J. Tansey |
Rockwell International |
1 |
| #38 |
Prashant Joshi |
Interconnect Systems |
1 |
| #38 |
Robert L. Borwick, III |
Teledyne Scientific & Imaging |
1 |
| #38 |
William E. Tennant |
Teledyne Scientific & Imaging |
1 |
| #38 |
Ji Lu |
Amgen |
1 |
| #38 |
Brian Hartman |
Microsoft |
1 |
| #38 |
Janet B. Davis |
The Boeing |
1 |
| #38 |
Jie Chang |
The Boeing |
1 |
| #38 |
Mark H. Norman |
Amgen |
1 |
| #38 |
Patrick John Laughlin |
Cooper Technologies |
1 |
| #38 |
Robert Chih-Jen Chi |
Np Photonics |
1 |
| #38 |
Winfred L. Morris |
Rockwell Automation |
1 |
| #38 |
Robert C. Addison |
Rockwell Automation |
1 |
| #38 |
Rey T. Chern |
Merck |
1 |
| #38 |
Michael J. Daily |
Hrl Laboratories |
1 |
| #38 |
Phillip T. Tokumaru |
Aerovironment |
1 |
| #38 |
Ian Coles |
— |
1 |
| #38 |
William Bowman |
Dayco Products |
1 |
| #38 |
Robert Kay |
K2R2 |
1 |
| #38 |
Wonill Ha |
Flextronics International Usa |
1 |
| #38 |
Harun Muliadi |
Qlogic |
1 |
| #38 |
James B. Kruger |
— |
1 |
| #38 |
John Longawa |
Line 6 |
1 |
| #38 |
Henry Descalzo Bathan |
Stats Chippac |
1 |
| #38 |
Carl Conrath |
Amgen |
1 |
| #38 |
Wenge Zhong |
Amgen |
1 |
| #38 |
Elwood K. Rodriguez |
— |
1 |
| #38 |
Steven B. Hobmann |
Multibeam Systems |
1 |
| #38 |
Ray Fallon |
American Power Conversion |
1 |
| #38 |
Joslyn B. Stuart |
— |
1 |
| #38 |
David Tso-Chin |
Hon Hai Precision Ind. Co. |
1 |
| #38 |
Kenneth J. Curran |
Smith Engineering |
1 |