Issued Patents 2004
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6777815 | Configuration of conductive bumps and redistribution layer on a flip chip | — | 2004-08-17 |
| 6680544 | Flip-chip bump arrangement for decreasing impedance | Hsueh-Chung Shelton Lu, Kenny Chang | 2004-01-20 |