Issued Patents 2004
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6703075 | Wafer treating method for making adhesive dies | Chung-Hung Lin, Kuang-Hui Chen, Shih-Wen Chou | 2004-03-09 |
| 6689638 | Substrate-on-chip packaging process | Chung-Hung Lin, Cho-Liang Chung, Yao-Jung Lee | 2004-02-10 |