Issued Patents 2004
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6697260 | High-speed package design with suspended substrates and PCB | Yu-Ju Chen, Michael Z. Wong, Hui-Hsien Wu | 2004-02-24 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6697260 | High-speed package design with suspended substrates and PCB | Yu-Ju Chen, Michael Z. Wong, Hui-Hsien Wu | 2004-02-24 |