Issued Patents 2004
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6734539 | Stacked module package | Yinon Degani, Liguo Sun, Meng Zhao | 2004-05-11 |
| 6680212 | Method of testing and constructing monolithic multi-chip modules | Yinon Degani, King Lien Tai | 2004-01-20 |
| 6678167 | High performance multi-chip IC package | Yinon Degani, King Lien Tai | 2004-01-13 |