Issued Patents 2004
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6793795 | Method for galvanically forming conductor structures of high-purity copper in the production of integrated circuits | Andreas Thies | 2004-09-21 |
| 6736983 | Method for producing microcomponents | Andreas Thies, Konrad Cramer | 2004-05-18 |
| 6723385 | Process for the preliminary treatment of copper surfaces | Udo Grieser, Uwe Hauf | 2004-04-20 |
| 6706201 | Method for producing metallized substrate materials | Ralf Schulz, Roland Heinz, Eckart Klusmann | 2004-03-16 |