Issued Patents 2004
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6766938 | Apparatus and method of placing solder balls onto a substrate | Ping Chun Benson Chong, Chi Fung Michael Chan, Chin Pang Chan | 2004-07-27 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6766938 | Apparatus and method of placing solder balls onto a substrate | Ping Chun Benson Chong, Chi Fung Michael Chan, Chin Pang Chan | 2004-07-27 |