Issued Patents 2004
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6833619 | Thin profile semiconductor package which reduces warpage and damage during laser markings | Sang Jae Jang, Sung Su Park, Sung Soon Park | 2004-12-21 |
| 6750545 | Semiconductor package capable of die stacking | Sang Jae Jang, Choon Heung Lee, Akito Yoshida | 2004-06-15 |