Issued Patents 2004
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6756658 | Making two lead surface mounting high power microleadframe semiconductor packages | Blake A. Gillett, Bradley D. Boland, Keith M. Edwards | 2004-06-29 |
| 6753597 | Encapsulated semiconductor package including chip paddle and leads | Angel Orabuena Alvarez | 2004-06-22 |
| 6707138 | Semiconductor device including metal strap electrically coupled between semiconductor die and metal leadframe | Blake A. Gillett, Bradley D. Boland, Philip S. Mauri, Ferdinand E. Belmonte, Remigio V. Burro, Jr. +1 more | 2004-03-16 |