MS

Mu Hwan Seo

AT Amkor Technology: 1 patents #32 of 77Top 45%
📍 Singapore, SG: #211 of 744 inventorsTop 30%
Overall (2004): #148,575 of 270,089Top 60%
1
Patents 2004

Issued Patents 2004

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
6696747 Semiconductor package having reduced thickness Tae Heon Lee 2004-02-24