Issued Patents 2004
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6737750 | Structures for improving heat dissipation in stacked semiconductor packages | Paul R. Hoffman | 2004-05-18 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6737750 | Structures for improving heat dissipation in stacked semiconductor packages | Paul R. Hoffman | 2004-05-18 |