Issued Patents 2004
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6762507 | Internal circuit structure of semiconductor chip with array-type bonding pads and method of fabricating the same | Wen-Lung Cheng, Hung-Cheng Huang | 2004-07-13 |
| 6759329 | Internal circuit structure of semiconductor chip with array-type bonding pads and method of fabricating the same | Wen-Lung Cheng, Hung-Cheng Huang | 2004-07-06 |
| 6707164 | Package of semiconductor chip with array-type bonding pads | Wen-Lung Cheng, Hung-Cheng Huang | 2004-03-16 |