Issued Patents 2004
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6818702 | Thermosetting resin composition and flexible circuit overcoating material comprising the same | Hiroshi Orikabe, Hiroshi Sakamoto | 2004-11-16 |
| 6805958 | Epoxy resin composition, and adhesive film and prepreg using the composition, and multilayer printed-wiring board using them, and process for manufacturing the same | Shigeo Nakamura | 2004-10-19 |
| 6739040 | Method of manufacturing multilayered printed wiring board using adhesive film | Shigeo Nakamura | 2004-05-25 |