Issued Patents 2004
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6731001 | Semiconductor device including bonded wire based to electronic part and method for manufacturing the same | Kan Kinouchi, Mitsuhiro Saitou, Takashi Nagasaka, Yuji Ootani, Hiroyuki Yamakawa +3 more | 2004-05-04 |
| 6678574 | Method for producing suspension parts of aluminum alloy | Takumi Fujii, Hiroyuki Tsutsumi, Yoshiya Inagaki, Atumi Fukuda | 2004-01-13 |