Issued Patents 2004
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6768190 | Stack type flip-chip package | Hsueh-Te Wang | 2004-07-27 |
| 6717253 | Assembly package with stacked dies and signal transmission plate | — | 2004-04-06 |
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6768190 | Stack type flip-chip package | Hsueh-Te Wang | 2004-07-27 |
| 6717253 | Assembly package with stacked dies and signal transmission plate | — | 2004-04-06 |