Issued Patents 2004
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6758263 | Heat dissipating component using high conducting inserts | Gary Chen | 2004-07-06 |
| 6746768 | Thermal interface material | Ronald Greinke | 2004-06-08 |
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6758263 | Heat dissipating component using high conducting inserts | Gary Chen | 2004-07-06 |
| 6746768 | Thermal interface material | Ronald Greinke | 2004-06-08 |