Issued Patents 2004
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6731463 | Wafer fabrication for thermal pole tip expansion/recession compensation | Jane Gates, Youping Mei, Lance E. Stover, Zine-Eddine Boutaghou, Wayne A. Bonin +1 more | 2004-05-04 |