Issued Patents 2003
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6607028 | Positioning structure for heat dissipating fins | Jack Wang, Michael Lin, Charles Ma | 2003-08-19 |
| 6595275 | Heat sink assembly | Jack Wang, Michael Lin, Charles Ma | 2003-07-22 |
| 6571862 | Heat dissipating fin | Jack Wang, Michael Lin, Charles Ma | 2003-06-03 |
| 6542370 | Heat dissipating device for a CPU | Jack Wang, Michael Lin, Charles Ma | 2003-04-01 |