Issued Patents 2003
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6601753 | Void-free die attachment method with low melting metal | Jay DeAvis Baker, Lawrence Kneisel, Mohan R. Paruchuri, Vivek Amir Jairazbhoy | 2003-08-05 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6601753 | Void-free die attachment method with low melting metal | Jay DeAvis Baker, Lawrence Kneisel, Mohan R. Paruchuri, Vivek Amir Jairazbhoy | 2003-08-05 |