RC

Ray Chien

VT Via Technologies: 2 patents #6 of 69Top 9%
Overall (2003): #47,515 of 273,478Top 20%
2
Patents 2003

Issued Patents 2003

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
6639324 Flip chip package module and method of forming the same — 2003-10-28
6566166 Method of manufacturing a cavity-down plastic ball grid array (CD-PBGA) substrate — 2003-05-20