Chi-Hsing Hsu

VT Via Technologies: 2 patents #6 of 69Top 9%

📍 New Taipei, TW: #44 of 327 inventorsTop 15%

Overall (2003): #73,025 of 273,478Top 30%

Patents 2003

Issued Patents 2003

Showing 1–2 of 2 patents

Patent #	Title	Co-Inventors	Date
6643136	Multi-chip package with embedded cooling element	—	2003-11-04
6596560	Method of making wafer level packaging and chip structure	—	2003-07-22