Issued Patents 2003
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6555414 | Flip-chip assembly of semiconductor devices using adhesives | Sergei Stoukach, Bjorn Vandecasteele | 2003-04-29 |
| 6548327 | Low cost electroless plating process for single chips and wafer parts and products obtained thereof | Herbert De Pauw, Suixin Zhang | 2003-04-15 |