Issued Patents 2003
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6638849 | Method for manufacturing semiconductor devices having copper interconnect and low-K dielectric layer | Jack Liang, Kuo-Ju Liu | 2003-10-28 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6638849 | Method for manufacturing semiconductor devices having copper interconnect and low-K dielectric layer | Jack Liang, Kuo-Ju Liu | 2003-10-28 |