Issued Patents 2003
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6506632 | Method of forming IC package having downward-facing chip cavity | Chih-Peng Fan, David C. H. Cheng | 2003-01-14 |
| 6506633 | Method of fabricating a multi-chip module package | Chih-Peng Fan, David C. H. Cheng | 2003-01-14 |