Issued Patents 2003
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6619537 | Diffusion bonding of copper sputtering targets to backing plates using nickel alloy interlayers | Hao Zhang, Ann Bolcavage | 2003-09-16 |
| 6579431 | Diffusion bonding of high purity metals and metal alloys to aluminum backing plates using nickel or nickel alloy interlayers | Ann Bolcavage | 2003-06-17 |