CH

Chung W. Ho

TM Thin Film Module: 2 patents #1 of 1Top 100%
📍 Taoyuan, NY: #1 of 4 inventorsTop 25%
Overall (2003): #73,053 of 273,478Top 30%
2
Patents 2003

Issued Patents 2003

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
6586846 Low cost decal material used for packaging 2003-07-01
6562656 Cavity down flip chip BGA 2003-05-13