TL

Tay LiangChee

TI Texas Instruments: 1 patents #317 of 1,093Top 30%
📍 Singapore, SG: #183 of 665 inventorsTop 30%
Overall (2003): #109,808 of 273,478Top 45%
1
Patents 2003

Issued Patents 2003

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
6531083 Sproutless pre-packaged molding for component encapsulation Mario A. Bolanos, Jeremias L. Libres, George A. Bednarz, Julius Lim, Ireneus J. T. M. Pas 2003-03-11