Issued Patents 2003
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6629013 | System and method to reduce bond program errors of integrated circuit bonders | David J. Bon | 2003-09-30 |
| 6597963 | System and method to recreate illumination conditions on integrated circuit bonders | David J. Bon | 2003-07-22 |
| 6555401 | Method of controlling bond process quality by measuring wire bond features | — | 2003-04-29 |
| 6510240 | Automatic detection of die absence on the wire bonding machine | David Ho, Yee Hsun U | 2003-01-21 |