Issued Patents 2003
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6653717 | Enhancement in throughput and planarity during CMP using a dielectric stack containing an HDP oxide | Manoj Kumar Jain | 2003-11-25 |
| 6586839 | Approach to structurally reinforcing the mechanical performance of silicon level interconnect layers | Darvin R. Edwards, Gregory B. Hotchkiss, Reynaldo Rincon, Viswanathan Sundararaman | 2003-07-01 |