Issued Patents 2003
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6563208 | Semiconductor package with conductor impedance selected during assembly | Heping Yue | 2003-05-13 |
| 6518663 | Constant impedance routing for high performance integrated circuit packaging | Richard D. James | 2003-02-11 |