Issued Patents 2003
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6586676 | Plastic chip-scale package having integrated passive components | Samuel D. Pritchett, Milton L. Buschbom | 2003-07-01 |
| 6541832 | Plastic package for micromechanical devices | — | 2003-04-01 |
| 6518089 | Flip chip semiconductor device in a molded chip scale package (CSP) and method of assembly | — | 2003-02-11 |