Issued Patents 2003
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6618933 | Liquid thermosetting insulating resin composition and method for permanently filling holes in printed circuit board by the use thereof | Rieko Yamamoto | 2003-09-16 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6618933 | Liquid thermosetting insulating resin composition and method for permanently filling holes in printed circuit board by the use thereof | Rieko Yamamoto | 2003-09-16 |