Issued Patents 2003
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6552433 | Bond pads using mesh pattern via structures for protecting devices/circuits under I/O pads | Kuo-Yu Chou | 2003-04-22 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6552433 | Bond pads using mesh pattern via structures for protecting devices/circuits under I/O pads | Kuo-Yu Chou | 2003-04-22 |