Issued Patents 2003
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6605525 | Method for forming a wafer level package incorporating a multiplicity of elastomeric blocks and package formed | Ming Lu, Jyh-Rong Lin | 2003-08-12 |
| 6596611 | Method for forming wafer level package having serpentine-shaped electrode along scribe line and package formed | Ming Lu | 2003-07-22 |
| 6539624 | Method for forming wafer level package | Ling-Chen Kung, Kuo-Chuan Chen, Ruoh-Huey Uang | 2003-04-01 |