LS

Leder Shiu

TSMC: 1 patents #218 of 754Top 30%
📍 Tainan, TW: #66 of 252 inventorsTop 30%
Overall (2003): #172,105 of 273,478Top 65%
1
Patents 2003

Issued Patents 2003

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
6653223 Dual damascene method employing void forming via filling dielectric layer — 2003-11-25