Issued Patents 2003
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6607116 | Method and apparatus for estimating quality of lead-free solder material and process and system for flow soldering | Kenichiro Suetsugu, Shunji Hibino, Yukio Maeda, Mikiya Nakata | 2003-08-19 |