HO

Hideo Ohkuma

IBM: 1 patents #1,943 of 5,539Top 40%
Overall (2003): #211,140 of 273,478Top 80%
1
Patents 2003

Issued Patents 2003

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
6554689 Work holding member for mechanical abrasion, abrading method, and abrading machine Satoshi Maruyama, Kiyoshi Tomiki, Makoto Fujikawa, Tomohito Johnai, Yutaka Kunii +1 more 2003-04-29