Issued Patents 2003
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6617943 | Package substrate interconnect layout for providing bandpass/lowpass filtering | — | 2003-09-09 |
| 6611048 | Exposed paddle leadframe for semiconductor die packaging | Roberto U. Villanueva | 2003-08-26 |
| 6608363 | Transformer comprising stacked inductors | — | 2003-08-19 |
| 6576983 | Controlled impedance leads in a leadframe for high frequency applications | Hassan S. Hashemi | 2003-06-10 |
| 6566761 | Electronic device package with high speed signal interconnect between die pad and external substrate pad | Laxminarayan Sharma | 2003-05-20 |
| 6534854 | Pin grid array package with controlled impedance pins | Hassan S. Hashemi, Roberto Coccioli | 2003-03-18 |
| 6512285 | High inductance inductor in a semiconductor package | Hassan S. Hashemi, Roberto Coccioli | 2003-01-28 |