Issued Patents 2003
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6507119 | Direct-downset flip-chip package assembly and method of fabricating the same | Yin-Jen Lin | 2003-01-14 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6507119 | Direct-downset flip-chip package assembly and method of fabricating the same | Yin-Jen Lin | 2003-01-14 |