Issued Patents 2003
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6649512 | Method for improving adhesion of a low k dielectric to a barrier layer | Chen-Chiu Hsue | 2003-11-18 |
| 6603167 | Capacitor with lower electrode located at the same level as an interconnect line | Chen-Chiu Hsue | 2003-08-05 |
| 6593225 | Method of forming a stacked dielectric layer on a semiconductor substrate having metal patterns | — | 2003-07-15 |
| 6548409 | Method of reducing micro-scratches during tungsten CMP | Chun Nien | 2003-04-15 |
| 6521523 | Method for forming selective protection layers on copper interconnects | Chen-Chiu Hsue | 2003-02-18 |
| 6514815 | Method for fabricating polysilicon capacitor | Chen-Chiu Hsue | 2003-02-04 |
| 6512260 | Metal capacitor in damascene structures | Chen-Chiu Hsue, Jen-Hann Tsai | 2003-01-28 |
| 6503835 | Method of making an organic copper diffusion barrier layer | — | 2003-01-07 |
| 6504205 | Metal capacitors with damascene structures | Chen-Chiu Hsue | 2003-01-07 |