Issued Patents 2003
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6518672 | Multi-layer wiring board substrate and semiconductor device using the multi-layer wiring substrate | Takashi Kurihara, Michio Horiuchi, Shigeru Mizuno | 2003-02-11 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6518672 | Multi-layer wiring board substrate and semiconductor device using the multi-layer wiring substrate | Takashi Kurihara, Michio Horiuchi, Shigeru Mizuno | 2003-02-11 |