Issued Patents 2003
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6662351 | Wiring editing method, for semiconductor package, capable of easily editing offset of wiring pattern | Tamotsu Kitamura, Takahide Ichimura, Hiroyuki Sakai | 2003-12-09 |
| 6596549 | Automatic wiring method for semiconductor package enabling design of high-speed wiring for semiconductor package with reduced labor | Tamotsu Kitamura | 2003-07-22 |