Issued Patents 2003
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6660944 | Circuit board having solder bumps | Yukihiro Kimura, Masashi Inaishi | 2003-12-09 |
| 6584219 | 2D/3D image conversion system | Syuugo Yamashita, Yukio Mori, Seiji Okada | 2003-06-24 |
| 6546622 | Printed-wiring substrate and method for fabricating the same | Masahiro Iba, Hisashi Wakako, Kazuhisa Sato, Kazuyuki Takahashi, Kenzo Kawaguchi | 2003-04-15 |