Issued Patents 2003
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6608380 | Semiconductor chip package having one or more sealing screws | Jung Hwan Chun, Heung-Kyu Kwon | 2003-08-19 |
| 6518660 | Semiconductor package with ground projections | Heung-Kyu Kwon, Tae-Je Cho | 2003-02-11 |