Issued Patents 2003
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6642627 | Semiconductor chip having bond pads and multi-chip package | Il-Heung Choi, Jeong-Jin Kim, Hae-Jeong Sohn, Chung Woo Lee | 2003-11-04 |
| 6617700 | Repairable multi-chip package and high-density memory card having the package | Joon Ki LEE, Young-Shin Kwon | 2003-09-09 |
| 6573611 | Dual-lead type square semiconductor package and dual in-line memory module using the same | Hai-Jeong Sohn, Jun-Young Jeon | 2003-06-03 |