Issued Patents 2003
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6621164 | Chip size package having concave pattern in the bump pad area of redistribution patterns and method for manufacturing the same | Chan Hwang | 2003-09-16 |
SJ
Seung Ouk Jung
Overall (2003): #122,465 of 273,478Top 45%
1
Patents 2003